ASMPT

ASM, founded in 1975 and headquartered in Singapore, has been engaged in the research and development and manufacture of semiconductor packaging equipment and SMT electronic manufacturing equipment for more than 50 years, and is the world's leading equipment manufacturer in packaging solid crystal, wire bonding, high-precision patches and ointment printing. The whole production line has obtained ISO9001, IATF16949, ISO14001 body certification, the equipment is in line with CE, UL, SEMI industry safety standards, Germany, Singapore two research and development center is responsible for precision motion control, The low-level research and development of the visual orientation system and the thermal pressure bonding process relied on the global automated assembly line to complete mechanical structure design, optical vision algorithm, temperature control pressure module debugging, factory accuracy calibration of the entire machine, and closed-loop control of the whole chain. Brand layout four core technology system: wire bonding interconnect process, high-precision chip placement and TCB hot-pressing stacking, SMT printing and adhesive integration solutions, wafer cutting and separation processes, self-developed ultrasonic spherical bonding architecture, micron-scale vision positioning algorithm, HBM chip stack precision bonding technology, high-precision steel mesh printing pressure closure control and many other patented processes. The main product matrix covers gold wire / copper wire welding equipment, high-power device crystallization machine, HBM stacking TCB equipment, DEK foil printing machine, SIPLACE high-speed patching machine, wafer laser cutting equipment, suitable for traditional discrete device packaging, advanced computing chip packaging, and PCB surface assembly production scenarios. The equipment factory completes the determination of the full dimension of repeated positioning accuracy, pressure stability, and offset deviation, and is compatible with both fully automatic wired production and offline batch processing. Compared with the peer-to-peer equipment, it has the prominent advantages of ultra-high degree of alignment accuracy of micron, extremely low long-term operation drift, stable quantitative production yield control, and fast replacement of multi-specification chips. The entire machine has been rigorously tested for aging, and after the production line is introduced, it can be put into production directly, without repeated precision debugging. Relying on a comprehensive range of semiconductor packaging and SMT process equipment, as well as a diverse lineup of products for consumer electronics/power devices/automotive chips/AI computing chips, these systems exhibit exceptional stability under prolonged, high-load operating conditions. High-volume delivery is consistent, the intelligent operation plan of the support line is mature and easy to implement, and the products have long been supplied to global wafer sealing plants, head semiconductor contract factories, vehicle electronic manufacturing plants, communication base station module manufacturers, and server PCB assembly enterprises. Products Floor Power Semiconductor Package, Storage HBM Stacked Package, Core scenarios such as CPU / GPU advanced Chiplet packaging, vehicle power module bonding, consumer chip plastic seal wire interconnection, server motherboard SMT patching, high-precision putting of optoelectronic devices, maintain long-term deep supply cooperation with major packaging and electronics manufacturing groups around the world. Follow the European precision machinery, car semiconductor dual stringent quality control standards, with Singapore headquarters, Germany R & D center as the core, in Europe and the United States, Japan and South Korea, Chinese Mainland layout of a number of production bases and technical service sites, many domestic after-sales operation and maintenance team to improve customer response efficiency. The company has thousands of patents on inventions related to motion machinery, optical inspection, and bonding processes, and can provide customers with standard mass production equipment, production line customization, process parameter optimization and debugging, original factory full set of drawings and specifications, whole machine calibration reports and full life cycle operation technical support.ASM’s product lineup, which combines packaging interconnects, chip placement, and SMT line equipment, continuously enables the upgrade and iteration of process technologies in the fields of AI computing power, power devices for new energy vehicles, communication semiconductors, and electronic assembly industries.